The transient thermal stress distributing behavior within a typical sofc stack during the preheating process

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dc.contributor.authorZhu Yanlong
dc.contributor.authorHan Shuo
dc.contributor.authorZhang Zhe
dc.contributor.authorXu Changchun
dc.contributor.authorSerbin Serhiy
dc.contributor.authorChen Daifen
dc.date.accessioned2023-11-28T08:44:29Z
dc.date.available2023-11-28T08:44:29Z
dc.date.issued2023
dc.descriptionThe transient thermal stress distributing behavior within a typical sofc stack during the preheating process / Y. Zhu, S. Han, Z. Zhang, C. Xu, S. Serbin, D. Chen // Матеріали ХIV міжнар. наук.-техн. конф. "Інновації в суднобудуванні та океанотехніці". – Миколаїв : НУК, 2023. – С. 715–719.
dc.description.abstract1Mechanical stability and integrity are essential prerequisites for achieving long term stability and maintaining high performance of solid oxide fuel cell (SOFC) stack, especially at the preheating stage. In this study, a transient 3D thermomechanical model basing on the realistic component structure is firstly developed for investigating the evolution of the transient thermal stress distribution with the running time during the preheating process. Then, the effects of different interconnector structures on the thermodynamic distributing characteristics within a typical SOFC stack at the preheating stages are analyzed. The coupling calculated results show that compared with the interconnector plate with rectangular ribs, using the cylindrical ribs for the anode and cathode sides can reduce the thermal stresses by 13 % and 25 %, respectively. The first principal stress of the electrolyte will be significantly affected by the interconnector structure features. Adopting the cylindrical ribs can reduce the first principal stress of the electrolyte by 150 MPa at 5400 s and keep it within the range of 20 MPa for all the preheating and working processes.
dc.description.provenanceSubmitted by Диндеренко Катерина (kateryna.dynderenko@nuos.edu.ua) on 2023-11-28T08:43:19Z workflow start=Step: reviewstep - action:claimaction No. of bitstreams: 1 Zhu.pdf: 856569 bytes, checksum: 430cba2bda37d1b894409f309eb03717 (MD5)en
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dc.description.provenanceStep: finaleditstep - action:finaleditaction Approved for entry into archive by Диндеренко Катерина(kateryna.dynderenko@nuos.edu.ua) on 2023-11-28T08:44:29Z (GMT)en
dc.description.provenanceMade available in DSpace on 2023-11-28T08:44:29Z (GMT). No. of bitstreams: 1 Zhu.pdf: 856569 bytes, checksum: 430cba2bda37d1b894409f309eb03717 (MD5) Previous issue date: 2023en
dc.identifier.isbn978-966-321-462-7
dc.identifier.urihttps://eir.nuos.edu.ua/handle/123456789/7535
dc.language.isoen
dc.relation.ispartofseriesУДК
dc.titleThe transient thermal stress distributing behavior within a typical sofc stack during the preheating process
dc.typeTheses

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